NSC 213 - Thin Films in Nanofabrication

3 Credit Hours (Lab)

This course covers thin film deposition and etching practices in Nanofabrication. The deposition techniques to be included in the first part of the course will include atmosphere, low pressure, and plasma enhanced chemical vapor deposition and sputtering, thermal evaporation, and beam evaporation physical vapor deposition. Materials to be considered will include dielectrics (nitride, oxide), polysilicon (doped and undoped), metals (aluminum, tungsten, copper), adhesion promoters and diffusion barriers. The second part of the course will focus on etching processes and will emphasize reactive ion etching (single wafer, batch), high-ion-density reactors, ion beam etching and wet chemical etching. Students will receive hands-on experience in depositing and etching dielectric, semiconductor, and metal materials using state-of-the- art tools and practicing many of the steps critical to Nanofabrication of semiconductor devices including microelectronics, MEMs devices, display structures, and structures used in the biotechnology fields.

Prerequisite(s): NSC 212