NSC 216 - Characterization, Packaging and Testing of Nanofabricated Structures

3 Credit Hours (Lab)

This course examines a variety of techniques and measurements essential for controlling device fabrication and final packaging. Monitoring techniques such as residual gas analysis (RGA), optical emission spectroscopy (OES) and end point detection will be discussed. Characterization techniques such as: surface profilometry, advanced optical microscopy, optical thin film measurements on device structures for yield analysis and process control will also be stressed. These will include breakdown measurements, junction testing, and CV and I-V tests and simple transistor characterization. In addition, we will examine mechanical as well as electrical characteristics of nanostructures for biological/biomedical applications. The students will perform DNA analysis by learning and performing the polymer chain reaction for DNA replication. They will also study and manufacture microfluidic channels for biological analysis. An extensive overview of biology will be given with emphasis on biocompatible materials. The student will also learn about the manufacturing issues involved in subjects such as interconnects, isolation, and final device assembly. Aluminum, refractory metals and copper deposition techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, stress effects, and adhesion. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing, and final test for both conventional ICs and novel MEM and biomedical devices will be examined.

Prerequisite(s): NSC 215